Research and Development Services

Our tremendous experience and dedication to a continuous research and development effort uniquely qualify us to service all of your dicing and cutting requirements. It is an exact and complicated technology, which is why it is important to deal with the industry leader. We offer free R&D services and develop custom dicing blades.

Request a free R&D
Send us the material you want to cut and we will identify the best dicing blades for the application, we have a complete dicing saw room and top tier cleanroom at our labs.
  • We dice your sample material and find the best Dicing Blade
  • Detailed reports using the optimal blade composition
  • Feeds and speeds
  • Return the material and reports with samples blades
  • Will assist in fixing any hardware issues like flanges and coolant
  • We work under NDA if needed

Case History:
Hewlett-Packard

Background:Decades ago, HP manufactured Sapphire wafers nobody else in our industry could cut.

Thermocarbon’s Action:
  • Designed a new blade matrix for cutting Sapphire.
  • Determined best parameters for matrix.
  • Stablished new exposure guidelines for Sapphire.
  • Discovered proper orientation and entry angles for cutting.
  • Perfected and implemented new mounting methods.
  • Applied consistent and repeatable flange torque practices.
Results: Successfully cut Sapphire wafers.
  • Provided higher cutting efficiency.
  • Reduced cost.
  • Pioneered the proper way to cut sapphire within our industry.

Contact area

Immediate Assistance
1-800-523-1946
407-834-7800Florida
407-767-8675
8:30am-5pm eastern
International Headquarters

Thermocarbon Inc.
391 Melody Ln W, Casselberry,
FL 32707