Background:Decades ago, HP manufactured Sapphire wafers nobody else in our industry could cut.
Research and Development Services
Our tremendous experience and dedication to a continuous research and development effort uniquely qualify us to service all of your dicing and cutting requirements. It is an exact and complicated technology, which is why it is important to deal with the industry leader. We offer free R&D services and develop custom dicing blades.
Send us the material you want to cut and we will identify the best dicing blades for the application, we have a complete dicing saw room and top tier cleanroom at our labs.
- We dice your sample material and find the best Dicing Blade
- Detailed reports on different blades showing life vs quality
- Feeds and speeds
- Return the material and reports with samples blades
- Will assist in fixing any hardware issues like flanges and coolant
- We work under NDA if needed