Choose the part number for dicing blades
SPECIAL PROCESS
GRIT / DIAMOND SIZE
THICKNESS
TOLERANCE
MATRIX
O.D.xI.D.
I.D. is not shown in part number
THICKNESS [Limited by]
- Grit size
- Matrix type
GRIT / DIAMOND SIZE
SPECIAL PROCESS [options]
- Slotting / Slits
- Notches
- Truing
- Custom Angles
- Gritblast
TOLERANCE
TCAR Proprietary Molding ensures top tier accuracy
MATRIX
MATRIX is what Thermocarbon uses to consolidate many complex variables to simplify what application is recommended to start from.
Dicemaster and Blademaster high quality diamond blades are available in a complete range of diameters from 2" through 5" to fit all dicing saws and conventional grinders. Thicknesses are available from .0015" through 5000" with various tolerance levels starting at +/-.0001".
Part Number Selector
Thermocarbon’s continuous research and development on hubless blade compositions allows Thermocarbon to consistently produce high-quality saw blades for cutting:
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QFN, MLF, MLPD, VQFN, PPF, DFN, BGA
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ceramics such as alumina oxide, alumina nitride, LTCC, HTCC
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crystals such as sapphire, lithium niobate, lithium tantalate
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other hard and brittle materials such as glass, fused silica, quartz, silicon wafers
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garnet, copper, mold compound, and epoxy
Popular Thermocarbon dicing products
R&D services
Blades
Flanges
Complimentary R&D Services
If none of our standard wafer dicing blades fit your needs, Thermocarbon will develop custom semiconductor dicing blades and flanges considering your material and dicing equipment.