Matrix Usage and Characteristics

R-3

Strong bonding of abrasives and the latest derivative of the first computer-designed R7-3 matrix exhibiting 20% to 30% longer blade life and improved cut quality. Designed for materials such as ceramics and crystalline materials where high throughput is desired.

D-3

This matrixi very similar to the "R-3" matrix listed above. The main difference is that this bond is a bit stronger than the "R-3" matrix.

RU-3

Weaker bonding of abrasives for where high cut quality is desired as in materials such as glass, sapphire, pyrex, lithium tantalite, lithium niobate, quartz, etc. where the cutting forces during dicing consistently exposes sharp new diamond edges in order to maintain quality of cut. This matrix is the latest derivative of the RU7-3.

RU-1

Same as the RU-3 bond except this matrix exhibits 1/3 of the diamond concentration. Best used where the highest quality of cut is desired and feed rates are not enough to guarantee the self-sharpening characteristics of the resin bonded blade due to light cutting forces on the individual diamond particles. This matrix is the latest derivative of the RU7-1.

DH3

A stronger bond over the R-3 series blades exhibiting longer blade life in material types like PCB, BGA, and similar applications.

QFDH3

Similar to DH-3 Series,but modified to cut QFN types of applications.

RA-3

Strong bonding of abrasives used primarily for metals utilzing boron nitride rather than diamond abrasives.This matrix replaces the AMR7-3.

RU-3S

Designed for materials such as LTCC type of materials, some ferrites, and material appications that demand extremely high quality specifications.

QF

Developed for dicing substrates such as those used for QFN, DFN, MLF, etc... types of appications. This matrix exhibits long blade life and high throughput.

QF1R

Developed for QFN, DFN, MLF, etc... types of applications. This blade was designed to help overcome poor rigidity cutting conditions.

QX Series

Further development of the matrices for cutting QFN type materials with too many modifications to continue to call it part if the QF series.The new QX series exhibits superior blade life over the QF series but cutting conditions must be closely controlled to maintain quality over the life of the blade.

HD1

Developed for dicing QFN, DFN, MLF, etc... types of applications. In some dissimilar QFN epoxy types; this matrix can attain excellent blade life and quality over the QF series blades.

HQ1

The HQ1 matrixis our next generation of blades to cut dissimilar materials such as QFN DFN, MLF, etc... types of applications. This matrix was created by taking into account both the epoxy/ceramic type encapsulations and the actual copper leads for life and quality. This HQ matrix is also stiffer allowing for the greater exposure than other type blades.

AN1

The AN1 matrix is our latest generation of blades to cut dissimilar materials such as QFN DFN, MLF, etc... types of applications also. This new AN1 matrix was designed to also run cooler as compared the QF and HQ1 series at faster feed rates with excellent quality.