Learn the basics of grinding and dicing technologies for better understanding of how to deal with diamond dicing method.
知識センター
半導体ダイシングにおけるThermocarbon Inc の40年以上の経験をもとに, ダイシング作業を最大限に効率化するための推奨事項を共有します.
Teaching you the basics of diamond dicing, blade exposure, wafer material efficiency. How to cut thicker materials with dicing blades.
The efficiency and necessity of colling in wafer diamond blade dicing – Thermocarbon.
Installing blades and flanges. Working surfaces, the importance of cleanliness. Diamond dicing tips.
Cooperation between Hewlett-Packard and Thermocarbon. A custom solution that we invented for a more sophisticated work.