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Thermocarbon a plus de 40 ans d'expertise dans l'industrie de la coupe en dés et du meulage de précision au diamant. Nous transformons notre expérience en contenu éducatif pour nos clients. Notre objectif est de présenter les aspects clés de la technologie complexe de la découpe. Il vous aidera à utiliser correctement l'équipement de découpe et à améliorer les résultats de vos opérations de coupe.

Part I: Introduction and Fundamental Requirements of Diamond Dicing

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Learn the basics of grinding and dicing technologies for better understanding of how to deal with diamond dicing method.

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Part II: Wafer dicing System and Substrate Interaction Considerations

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Teaching you the basics of diamond dicing, blade exposure, wafer material efficiency. How to cut thicker materials with dicing blades.

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Thermocarbon takes dicing technology to new levels

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Diamond dicing blades designed and manufactured in the United States by the industry leader in diamond grinding technology – Thermocarbon.

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Why is efficient cooling necessary?

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The efficiency and necessity of colling in wafer diamond blade dicing – Thermocarbon.

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Some of the common problems when using dicing blades

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Installing blades and flanges. Working surfaces, the importance of cleanliness. Diamond dicing tips.

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Case History No. 1: Hewlett-Packard, Cupertino Integrated Circuit Division

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Cooperation between Hewlett-Packard and Thermocarbon. A custom solution that we invented for a more sophisticated work.

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