Nuestro Blog

Thermocarbon tiene más de 40 años de experiencia en la industria de cortando materiales y moliendo con diamantes de precisión. Convertimos nuestra experiencia en contenido educativo para nuestros clientes. Nuestro objetivo es presentar los aspectos clave de esta tecnología compleja para poder cortar. Le ayudaremos a usar el equipo de cortar correctamente el que le mejorara los resultados de sus operaciones.

Part I: Introduction and Fundamental Requirements of Diamond Dicing

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Learn the basics of grinding and dicing technologies for better understanding of how to deal with diamond dicing method.

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Part II: Wafer dicing System and Substrate Interaction Considerations

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Teaching you the basics of diamond dicing, blade exposure, wafer material efficiency. How to cut thicker materials with dicing blades.

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Thermocarbon takes dicing technology to new levels

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Diamond dicing blades designed and manufactured in the United States by the industry leader in diamond grinding technology – Thermocarbon.

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Why is efficient cooling necessary?

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The efficiency and necessity of colling in wafer diamond blade dicing – Thermocarbon.

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Some of the common problems when using dicing blades

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Installing blades and flanges. Working surfaces, the importance of cleanliness. Diamond dicing tips.

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Case History No. 1: Hewlett-Packard, Cupertino Integrated Circuit Division

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Cooperation between Hewlett-Packard and Thermocarbon. A custom solution that we invented for a more sophisticated work.

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