Learn the basics of grinding and dicing technologies for better understanding of how to deal with diamond dicing method.
Parte I: Introducion y requisitos fundamentales de para cuchillas de diamantes
El mas importante riquisito para cortar wafers bien. Es elejir la maquinaria para el sistema de corte de el wafer cuchillas, flanges, y spacers.
Thermocarbon lleva la technologia de cortar a nuevo niveles
Come hacer los mas importantes componentes y sistemas para cortar wafers interactuar? Empesando con una efectiva forma de sistema para cortar
Cetro de Conocimiento
Con mas de 40-Años de experiencia de Thermocarbon inc cortando semiconductors, nosotros compartimos recommendaciones para mejorar tus operaciones de cortes para tener maxima eficiencia
Teaching you the basics of diamond dicing, blade exposure, wafer material efficiency. How to cut thicker materials with dicing blades.
Diamond dicing blades designed and manufactured in the United States by the industry leader in diamond grinding technology – Thermocarbon.
The efficiency and necessity of colling in wafer diamond blade dicing – Thermocarbon.
Installing blades and flanges. Working surfaces, the importance of cleanliness. Diamond dicing tips.
Cooperation between Hewlett-Packard and Thermocarbon. A custom solution that we invented for a more sophisticated work.