Learn the basics of grinding and dicing technologies for better understanding of how to deal with diamond dicing method.
Part I: Introduction and Fundamental Requirements of Diamond Dicing
The main requirements for successful wafer dicing. How to choose the equipment for the wafer dicing system: dicing blades, dicing flanges, and spacers.
With over 40-year experience of Thermocarbon inc in semiconductor dicing, we share recommendations to enhance your dicing operations to the maximum efficiency.
Teaching you the basics of diamond dicing, blade exposure, wafer material efficiency. How to cut thicker materials with dicing blades.
Diamond dicing blades designed and manufactured in the United States by the industry leader in diamond grinding technology – Thermocarbon.
Installing blades and flanges. Working surfaces, the importance of cleanliness. Diamond dicing tips.
Cooperation between Hewlett-Packard and Thermocarbon. A custom solution that we invented for a more sophisticated work.