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Thermocarbon 在切割和精密金刚石研磨行业拥有超过 40 年的专业知识。我们将我们的经验转化为对我们客户的教育内容。我们的目标是介绍复杂切割技术的关键方面。它将帮助您正确使用切割设备并改善切割操作的结果。

Part II: Wafer dicing System and Substrate Interaction Considerations

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Teaching you the basics of diamond dicing, blade exposure, wafer material efficiency. How to cut thicker materials with dicing blades.

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Part I: Introduction and Fundamental Requirements of Diamond Dicing

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Learn the basics of grinding and dicing technologies for better understanding of how to deal with diamond dicing method.

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