Learn the basics of grinding and dicing technologies for better understanding of how to deal with diamond dicing method.
凭借 Thermocarbon 公司 在半导体切割领域 40 多年的经验，我们分享建议和经验，希望最大效率的帮助和优化贵司的产品切割效能。
Teaching you the basics of diamond dicing, blade exposure, wafer material efficiency. How to cut thicker materials with dicing blades.
The efficiency and necessity of colling in wafer diamond blade dicing – Thermocarbon.
Installing blades and flanges. Working surfaces, the importance of cleanliness. Diamond dicing tips.
Cooperation between Hewlett-Packard and Thermocarbon. A custom solution that we invented for a more sophisticated work.