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Thermocarbon has over 40-year expertise in dicing and precision diamond grinding industry. We convert our experience into educational content for our clients. Our aim is to introduce the key aspects of complex dicing technology. It will help you use dicing equipment properly and improve the results of your dicing operations.

Part II: Wafer dicing System and Substrate Interaction Considerations

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Teaching you the basics of diamond dicing, blade exposure, wafer material efficiency. How to cut thicker materials with dicing blades.

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Part I: Introduction and Fundamental Requirements of Diamond Dicing

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Learn the basics of grinding and dicing technologies for better understanding of how to deal with diamond dicing method.

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