The leader in dicing and precision diamond grinding technology

We provide next-generation blades and flanges for semiconductor dicing


Dicemaster semiconductor dicing blades and flanges

Thermocarbon is a global leader in dicing and diamond grinding industry


The leading manufacturer of dicing blades and flanges

For over 40 years, Thermocarbon provides next-gen products for wafer dicing



Dicing blades /
Diamond wheels

  • Cut with closer tolerances than any other blade on the market!
  • Cost-effective alternative for metal blade applications
  • Consistent Reliability
  • Self-Sharpening
  • Run Cooler and Last Longer
  • Chip less


Next Generation

  • Completely custom non-stock flanges.
  • Titanium, stainless steel, hard anodize aluminum with assorted colors.
  • Allow custom O.D. Exposure.
  • Incomparable parallelism.

Our Services

We continously develop new blades in order to help our customers, reducing costs and improving quality, free of charge

If you have any questions or need help, feel free to contact with our team, or you can call us any time
Phone: 1-800-523-1946
Florida Phone: 407-834-7800
Fax: 407-767-8675

Contact Us
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Customer Service

Sales team

Our sales team in constantly training in all applications and processes to improve customers bottom line

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Travel for our clients

We will travel all over the globe for our customers an no charge

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Сustomer attitude

We treat our customers equally, no matter how big or small

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Local distributors

We have excellent local distributors in all continents willing to step in and help

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Many languages

Our staff is fluent in Chinese, Japanese, Spanish, Italian, Russian, and English

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Part Number Selector


Dicemaster and Blademaster high-quality diamond blades are avalible in a complete range of diameters from 2″ to 5″ to fit all dicing saws and conventional grinders. Thicknesses are avalible from .0015″ through .500″ with various tolerance levels starting.

Select the part number for dicing blades based on the main criteria

"So often in business I seem to make a call and end up talking to a machine or someone who knows (or cares) virtually nothing about the concerns I have. Thermocarbon was a real breath of fresh air!"

D. Schroerler-Niagara

College of AppliedArts and Technologies

"I recommend your company for hiring such expert people to service your products and customers. All my dicing needs will be obtained through Thermocarbon from now on!"

M. Ascerno

Sr Lab Technician of MMC

"It isn't often that a vendor will volunteer to come in at no charge and make suggestions to improve an operation, especially when the improvements will drastically reduce the sale of his product"

H.T. Malafl-Hail

Cutler- Hammer Division

Knowledge Center

With over 40-year experience of Thermocarbon inc in semiconductor dicing, we share recommendations to enhance your dicing operations to the maximum efficiency.

Revolutionizing the Diamond Resin Bond Dicing Industry: Thermocarbon's Unparalleled Contribution


Revolutionizing the Diamond Resin Bond Dicing Industry: Thermocarbon's Unparalleled Contribution

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Part I: Introduction and Fundamental Requirements of Diamond Dicing


Learn the basics of grinding and dicing technologies for better understanding of how to deal with diamond dicing method.

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Part II: Wafer dicing System and Substrate Interaction Considerations


Teaching you the basics of diamond dicing, blade exposure, wafer material efficiency. How to cut thicker materials with dicing blades.

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Contact area

Immediate Assistance
8:30am-5pm eastern
International Headquarters

Thermocarbon Inc.
391 Melody Ln W, Casselberry,
FL 32707